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oH VE S CO AV R M AI SIO PL LA N IA BL S NT E
TISP4600F3, TISP4700F3 HIGH VOLTAGE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
*R
TISP4600F3, TISP4700F3
Ion-Implanted Breakdown Region Precise and Stable Voltage Low Voltage Overshoot under Surge
Device `4600 `4700 VDRM V 420 500 V(BO) V 600 700
LM Package (Top View)
T(A) NC R(B)
1 2 3
MD4XATA
NC - No internal connection on pin 2
Rated for International Surge Wave Shapes
Wave Shape 2/10 8/20 10/160 10/700 10/560 10/1000 Standard GR-1089-CORE IEC 61000-4-5 FCC Part 68 FCC Part 68 ITU-T K.20/21 FCC Part 68 GR-1089-CORE ITSP A 190 175 110 70 50 45
LMF Package (LM Pkg. with Formed Leads) (Top View)
T(A) NC R(B)
1 2 3
MD4XAKC
NC - No internal connection on pin 2
Device Symbol
T
.......................................UL Recognized Component Description These devices are designed to limit overvoltages between a system SD4XAA R and the protective ground. The TISP4700F3 is designed for insulation protection of systems such as LANs, and allows a float voltage of Terminals T and R correspond to the 500 V without clipping. IEC 60950 and UL 1950 have certain requirealternative line designators of A and B ments for incoming lines of telephone network voltage (TNV). Any protector from the line to ground must have a voltage rating of 1.6 times the equipment rated voltage. International and European equipment usually have maximum rated voltages of 230 V rms, 240 V rms or 250 V rms. Multiplying the 250 V value by 1.6 gives a protector VDRM value of 400 V. Allowing for operation down to 0 C gives a VDRM value of 420 V at 25 C. This need is met by the TISP4600F3. The protector consists of a symmetrical voltage-triggered bidirectional thyristor. Overvoltages are initially clipped by breakdown clamping until the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state causes the current resulting from the overvoltage to be safely diverted through the device. The high crowbar holding current prevents d.c. latchup as the diverted current subsides. A single device provides 2-point protection. Combinations of devices can be used for multipoint protection (e.g. 3-point protection between Ring, Tip and Ground). The TISP4x00F3 is guaranteed to voltage limit and withstand the listed international lightning surges in both polarities. This protection device is in a DO-92 (LM) cylindrical plastic package. How To Order
For Standard Termination Finish Order As TISP4x00F3LM TISP4x00F3LMR For Lead Free Termination Finish Order As TISP4x00F3LM-S TISP4x00F3LMR-S
Device TISP4x00F3 TISP4x00F3 TISP4x00F3
Package LM, Straight Lead DO-92 LM, Straight Lead DO-92 LMF, Formed Lead DO-92
Carrier Bulk Pack Tape And Reel Tape And Reel
TISP4x00F3LMFR TISP4x00F3LMFRS
Insert x = 6 for TISP4600F3 and x= 7 for TISP4700F3
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
Absolute Maximum Ratings, TA = 25 C (Unless Otherwise Noted)
Rating Repetitive peak off-state voltage Non-repetitive peak on-state pulse current (see Notes 1 and 2) 2/10 (Telcordia GR-1089-CORE, 2/10 voltage wave shape) 1/20 (ITU-T K.22, 1.2/50 voltage wave shape, 25 resistor) 8/20 (IEC 61000-4-5, combination wave generator, 1.2/50 voltage wave shape) 10/160 (FCC Part 68, 10/160 voltage wave shape) 4/250 (ITU-T K.20/21, 10/700 voltage wave shape, simultaneous) 5/310 (ITU-T K.20/21, 10/700 voltage wave shape, single) 5/320 (FCC Part 68, 9/720 voltage wave shape, single) 10/560 (FCC Part 68, 10/560 voltage wave shape) 10/1000 (Telcordia GR-1089-CORE, 10/1000 voltage wave shape) Non-repetitive peak on-state current (see Notes 1 and 2) 50/60 Hz, 1s ITSM di T/dt TJ Tstg IPPSM 190 100 175 110 95 70 70 50 45 6 250 -40 to +150 -65 to +150 A A/s C C A TISP4600F3 TISP4700F3 Symbol VDRM Value 420 500 Unit V
Initial rate of rise of on-state current, Linear current ramp, Maximum ramp value < 38 A Junction temperature Storage temperature range
NOTES: 1. Initially, the TISP must be in thermal equilibrium with TJ = 25 C. 2. These non-repetitive rated currents are peak values of either polarirty. The surge may be repeated after the TISP returns to its initial conditions.
Recommended Operating Conditions
Component Series resistor for GR-1089-CORE first-level surge survival Series resistor for ITU-T recommendation K.20 and K.21 R1, R2 Series resistor for FCC Part 68 9/720 survival Series resistor for FCC Part 68 10/160, 10/560 survival Min 15 0 0 10 Typ Max Unit
Electrical Characteristics, TA = 25 C (Unless Otherwise Noted)
Parameter IDRM Repetitive peak offstate current VD = V DRM dv/dt = 700 V/ms, R SOURCE = 300 dv/dt = 700 V/ms, R SOURCE = 300 IT = 5 A, di/dt = +/-30 mA/ms Linear voltage ramp, Maximum ramp value < 0.85V DRM VD = 50 V f = 100 kHz, Vd = 1 V rms, VD = 0, f = 100 kHz, Vd = 1 V rms, VD = -50 V 44 11 TISP4600F3 TISP4700F3 0.1 0.15 5 10 74 20 Test Conditions Min Typ Max 5 600 700 Unit A V A A kV/s A pF
V(BO) Breakover voltage I(BO) IH dv/dt ID Coff Breakover current Holding current Critical rate of rise of off-state voltage Off-state current Off-state capacitance
NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
Thermal Characteristics
Parameter Test Conditions EIA/JESD51-3 PCB, IT = ITSM(1000) , TA = 25 C, (see Note 3) 265 mm x 210 mm populated line card, 4-layer PCB, IT = ITSM(1000) , TA = 25 C 57 Min Typ Max 120 C/W Unit
RJA
Junction to free air thermal resistance
NOTE
3: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths.
Parameter Measurement Information
+i ITSP Quadrant I Switching Characteristic
ITSM
V(BO)
IH IDRM -v VDRM IDRM IH V(BO) ITSM Quadrant III Switching Characteristic I ITSP -i PMXXAJ A VD ID ID VD VDRM +v I(BO)
I(BO)
Figure 1. Voltage-Current Characteristic for R-T Terminal Pair
NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
Typical Characteristics
OFF-STATE CURRENT vs JUNCTION TEMPERATURE
100
TC3LAF
1.10
NORMALIZED BREAKOVER VOLTAGE vs JUNCTION TEMPERATURE TC3MAIA
10 ID - Off-State Current - A
Normalized Breakover Voltage
1.05
1
0*1
V D = 50 V VD = -50 V
1.00
0*01
0.95
0*001 -25 0 25 50 75 100 125 150 TJ - Junction Temperature - C
-25
0
25
50
75
100
125
150
TJ - Junction Temperature - C
Figure 2.
Figure 3.
HOLDING CURRENT vs JUNCTION TEMPERATURE
0.5 0.4
TC3LAHA
I H - Holding Current - A
0.3
0.2
0.1 -25 0 25 50 75 100 125 150 TJ - Junction Temperature - C
Figure 4.
NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
Thermal Information
NON-REPETITIVE PEAK ON-STATE CURRENT vs CURRENT DURATION TI4FA B
15 ITSM(t) - Non-Repetitive Peak On-State Current - A VGEN = 1500 Vrms, 50/60 Hz RGEN = 1.4*VGEN/ITSM(t) 10 9 8 7 6 5 4 3 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 C
2 1.5 0*1
1
10 t - Current Duration - s
100
1000
Figure 5.
NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
APPLICATIONS INFORMATION
IEC 60950, EN 60950, UL 1950 and CSA 22.2 No.950
The `950 family of standards have certain requirements for equipment (EUT) with incoming lines of telecommunication network voltage (TNV). Any protector from a TNV conductor to protective ground must have a voltage rating of at least 1.6 times the equipment rated supply voltage (Figure 6). The intent is to prevent the possibility of the a.c. mains supply voltage from feeding into the telecommunication network and creating a safety hazard. International and European equipment usually have maximum rated voltages of 230 V rms, 240 V rms or 250 V rms. Multiplying the 250 V value by 1.6 gives a protector VDRM value of 400 V. Allowing for operation down to 0 C gives a VDRM requirement of 420 V at 25 C. This need is met by the TISP4600F3.
Overvoltage Protectors bridging insulation
AC SUPPLY
Telecommunication network connection EUT Insulation
Th1 Th2
Protective ground connection
2 x TISP 4600F3
AI4XAI
Figure 6. '950 TNV Network Insulation from Protective Ground
LAN Insulation Protection
In Figure 7, a low-voltage protector, Th1, from the TISP40xxL1 series limits the inter-conductor voltage of the LAN and the high-voltage protector, Th2, limits the insulation stress to 700 V. The four diode bridge, D1 through D4, reduces the capacitive loading of the protectors on the LAN and means that only one TISP4700F3 is needed to be used for insulation protection of both LAN conductors. Low voltage diodes can be used as the maximum reverse voltage stress is limited to the V(BO) value of the TISP40xxL1 protector plus the diode forward recovery voltage.
TISP 40xxL1 Th1 Th2 TISP 4700F3
AI4XAJ
D3
D1
D4
D2
LAN CONDUCTORS
Figure 7. LAN Protection
NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
MECHANICAL DATA
Device Symbolization Code
Devices will be coded as follows:
Device TISP46 00F3 TISP47 00F3
Symbolization Code 4600F3 4700F3
NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
MECHANICAL DATA
LM002 (DO-92) 2-Pin Cylindrical Plastic Package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
LM002 Package (DO-92)
4.44 - 5.21 (.175 - .205) 3.43 MIN. (.135) 2.03 - 2.67 (.080 - .105) 3.17 - 4.19 (.125 - .165)
2.03 - 2.67 (.080 - .105)
4.32 - 5.34 (.170 - .210)
MAX.
2.20 (.086)
2
A
2
MIN.
12.7 (0.5)
0.40 - 0.56 (.016 - .022)
1
3
3
1
VIEW A
1.14 - 1.40 (.045 - .055) 0.35 - 0.41 (.014 - .016)
2.41 - 2.67 (.095 - .105)
DIMENSIONS ARE:
MILLIMETERS (INCHES) MD4XARA
NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
MECHANICAL DATA
LM002 (DO-92) - Formed Leads Version - 2-Pin Cylindrical Plastic Package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
LMF002 (DO-92) - Formed Leads Version of LM002
4.44 - 5.21 (.175 - .205) 3.43 MIN. (.135) 2.03 - 2.67 (.080 - .105) 3.17 - 4.19 (.125 - .165)
2.03 - 2.67 (.080 - .105)
4.32 - 5.34 (.170 - .210)
MAX.
2.20 (.086)
MAX.
4.00 (.157)
2
A
2
0.40 - 0.56 (.016 - .022)
1
3
3 VIEW A
2.40 - 2.90 (.094 - .114) 0.35 - 0.41 (.014 - .016)
1
2.40 - 2.90 (.094 - .114)
DIMENSIONS ARE:
MILLIMETERS (INCHES) MD4XASA
NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
MECHANICAL DATA
LM Tape Dimensions
LM002 Package (Straight Lead DO-92) Tape 11.70 - 13 .70 (.461 - .539)
LM002 Tape Dimensions Conform to the Requirements of EIA-468-B
Body Indent Visible
23.00 - 32.00 (.906 - 1.260) 17.66 - 27.68 (.695 - 1.090) 8. 50 - 11.00 (.335 - .433)
2.50 MIN . (.098)
0.00 - 0.50 (.000 - .020) 8.50 - 9.75 (.335 - .384) 5.50 - 19.00 (.217 - .748) 17.50 - 19 .00 (.689 - .748)
2.14 - 3.14 (.084 - .124) Adhesive Tape on Reverse Side - Shown Dashed 4.68 - 5.48 (.184 - .216) VIEW A 12.40 - 13.00 (.488 - .512)
3.70 - 4.30 (.146 - .169)
Tape Section Shown in View A
Flat of DO-92 Body Towards Reel Axis Direction of Feed
DIMENSIONS ARE:
MILLIMETERS (INCHES)
MD4X APD
NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
MECHANICAL DATA
LMF Tape Dimensions
LMF002 Package (Formed Lead DO-92) Tape
11.70 - 13.70 (.461 - .539)
LMF002 Tape Dimensions Conform to the Requirements of EIA-468-B
Body Indent Visible
23.00 - 32.00 (.906 - 1.260) 17.66 - 27.68 (.695 -1.090) 15.50 - 16.53 (.610 - .650)
2.50 MIN. (.098)
0.00 - 0.50 (0.00 - .020)
8.50 - 11.00 (.335 - .433)
8.50 - 9.75 (.335 - .384) 5.50 - 19.00 (.217 - .748) 17.50 - 19.00 (.689 - .748)
4.88 - 5.28 (.192 - .208)
DIA.
Adhesive Tape on Reverse Side - Shown Dashed
3.41 - 4.21 (.134 - .166) 12.40 - 13.00 (.488 - .512)
VIEW A
3.70 - 4.30 (.146 - .169)
Tape Section Shown in View A
Flat of DO-92 Body Towards Reel Axis
Direction of Feed
MILLIMETERS (INCHES) MD4XAQC
DIMENSIONS ARE:
"TISP" is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office. "Bourns" is a registered trademark of Bourns, Inc. in the U.S. and other countries.
NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.

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